HDI PCB
High-density interconnect boards for compact products, fine-pitch components and dense BGA breakout.
HDI PCB with ShinePCB
HDI boards use microvias, blind and buried vias and fine lines to route more connections in less space. Because feasibility depends on the complete design, we review via structure, stack-up and routing together before quotation.
- Microvia and blind or buried via structure
- Fine-line routing and spacing
- Via-in-pad and fill requirements
- Lamination sequence and materials
Capability and certificates
| Positioning | Blind/Buried Via, Microvia | |
|---|---|---|
| Standard / prototype | Advanced / mass production | |
| HDI PCB | 9th Order; Blind/Buried Via 0.05mm | 5th Order; Blind/Buried Via 0.075mm |
Related certificates
- ISO 9001:2015133628
- UL 796E466435
- IECQ QC 080000IECQ-H NQAGB 25.0038
Source: ShinePCB capability workbook, navigation overview. Values are confirmed against your files and the assigned facility during engineering review; certificates are available on request.
HDI capability
| Parameter | Prototype | Mass production |
|---|---|---|
| Rigid — HDI level | 9th order | 5th order |
| Rigid — Min trace / space | 1.5 / 1.5 mil | 2 / 2 mil |
| Rigid — Min blind / buried via diameter | 0.05 mm | 0.075 mm |
| Rigid — Min through-hole diameter | 0.075 mm | 0.10 mm |
| Rigid — Layer registration accuracy | 0.8 mil | 1 mil |
| Rigid — Max aspect ratio | 35:1 | 30:1 |
| Rigid — Impedance control tolerance | ±5% | ±7% |
| FPC — HDI capability | 4-layer any-layer interconnect | 6-layer any-layer interconnect |
| FPC — Min BGA pitch | 150 µm | 100 µm |
| FPC — Min blind via diameter | 0.05 mm | 0.05 mm |
Source: ShinePCB capability workbook (rigid PCB 2025 values; FPC sheet without year). Prototype and mass-production values are listed separately and are not interchangeable. Every value is confirmed against your files, the selected material and the assigned facility during engineering review.
Typical applications
Portable and wearable devices
Compact communication modules
Embedded computing boards
From prototype to production
Every order follows the same controlled sequence. Prototype and production requirements are reviewed separately.
File review
Gerber or ODB++, drill data, drawing and quantities are checked for completeness.
Engineering questions
Open points on manufacturability, materials or special processes are sent before quotation.
Stack-up and material
Construction, laminate and finish are confirmed with you and written into the order.
Fabrication
The order is released to the facility whose process and qualification fit the requirements.
Inspection and test
Inspection and electrical test follow the methods agreed for your order.
Packing and delivery
Boards are packed and shipped under the confirmed delivery terms.
What to send for a PCB review
Start with the details you have — engineering will request anything else needed for the review.
Files and details for a PCB review
- Gerber (RS-274X) or ODB++ data with drill files
- Fabrication drawing with material, thickness and finish
- Stack-up and impedance targets, if any
- Quantity for prototype and for production
- Special requirements such as IPC class, testing or packaging
Technical files stay private
Customer Gerber, BOM and design data are managed under an ISO/IEC 27001 information security system and shared only within your project.
HDI PCB FAQs
Do you support stacked and staggered microvias?
Via structures are reviewed per design. Engineering confirms the feasible structure before quotation.
Is HDI always more expensive?
HDI adds process steps, but it can reduce layer count or board size. We explain the trade-offs during review.
